MBA offers full-service printed circuit board manufacturing here in the Silicon Valley, with high quality and competitive pricing. In-terms of mass production of 2L to 16L, MBA works closely with our Parent company, IBE Electronics in China which offers our customers a strong advantage with reduced lead-times and reduced prices, while all being managed through our Silicon Valley facility. All files receive a full CAM review and all boards are inspected to IPC-A600 Class 2 or higher standards. Compare price & lead-times by getting an online quote, or contact MBA directly.
| Item | Mass Production | Small Batch |
|---|---|---|
| Number of Layers | Up to 16 | Up to 30 |
| Laminate | FR4, Halogen free, High TG, CEM3, PTFE, Aluminum BT, Rogers | " |
| Maximum Board Size | 610mm x 460mm | 762mm x 508mm |
| Board Thickness | 0.3-3.5mm | 0.21-6.0mm |
| Minimum Line Width/Space | 0.1/0.1mm | 0.076/0.076mm |
| Minimum Line Gap | +/-15% | +/-10% |
| Outer Layer Copper Thickness | 140um | 245um |
| Inner Layer Copper Thickness | 70um | 245um |
| Min. Finished Hole Size (Mechanical) | 0.2mm | 0.15mm |
| Min. Finished Hole Size (Lazer) | 0.1mm | 0.1mm |
| Aspect Ratio | 10:1 | 20:1 |
| Solder Mask Color | Green, Blue, Black, White, Yellow, Grey | " |
| Impedance Control Tolerance | <=+/-10% | " |
| Surface Treatment | ||
| Flash Gold | 0.025-0.075um | 0.025-0.5um |
| Immersion Gold | 0.05-0.1um | 0.1-0.2um |
| Sn/Pb HASL | 1-70um | 1-70um |
| Leadfree HASL | 1-70um | 1-70um |
| Immersion Silver | 0.08-0.3um | 0.08-0.3um |
| OSP(Entek) | 0.2-0.4um | 0.2-0.4um |
| Gold Finger | 0.375um| >=1.75um |
|
| Hard Gold Plating | 0.375um| >=1.75um |
|
| Immersion Sn | 0.8um|
| |
| v-cut | ||
| V-Cut Degree | 20,30,45,60 | " |
| OP Chamfer Angle Type | 30,45,60 | " |
| Chamfer (Angle Type) | 30,45,60 | " |
| Plug via hole (Max Size) | 0.6mm | 0.7mm |
